Hole metallizationand plating technology are widely used in PCB manufacturing procedure to solve the key problems of interlayer connection or conduction. In the process of acidic copper plating in PCB, special organic additives are added to obtian metal deposit layer with fine grain, uniform copper distribution on the board and preferable via filling ability. In this process, the coating design of insoluble titanium anode plays a role in ensuring the uniformity of current distribution and controlling the reasonable and effective additive consumption.

 

Applications

· PCB VCP DC Copper Plating

- Through hole and blind hole copper plating

- Blind hole and through hole via filling plating

· ·PCB RPP Copper Plating

- Horizontal pulse plating - through hole filling plating

- Vertical pulse plating - high aspect ratio through hole plating

· PCB Gold Plating

· Semiconductor Plating

- RTR plating

- Lead frame plating

 

Products and services

· Special Selecta ® mixed metal oxide (MMO) coated titanium anode for VCP

· Special mixed metal oxide (MMO) coated titanium anode for RPP

· Development of coatings with low consumption of additives (based on specific additive types)

· Recoating of plate anode（over 3mm）

· Quantitative detection of additive consumption（CVS）